Wire cutting device and wire cutting method
The invention discloses a linear cutting device and a linear cutting method. The linear cutting device comprises a supporting assembly, a cutting assembly and a cutting platform, and the supporting assembly comprises a base and a rack installed on the base; the cutting assembly comprises a cutting w...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a linear cutting device and a linear cutting method. The linear cutting device comprises a supporting assembly, a cutting assembly and a cutting platform, and the supporting assembly comprises a base and a rack installed on the base; the cutting assembly comprises a cutting wheel set. The cutting platform is used for being connected with a workpiece which can rotate around the axis of the workpiece. Wherein the cutting line is connected with the negative electrode of the power supply to form a tool electrode; the workpiece is connected with the anode of the power supply to form a workpiece electrode; when rotary cutting is needed, the workpiece is controlled to rotate automatically, and rotary cutting is formed between the cutting line and the workpiece; when electrified cutting is needed, the power supply is controlled to be turned on, and electrified cutting is formed between the cutting line and the workpiece; the electric discharge machining is beneficial to realizing abrasive part |
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