Binding agent and superfine diamond grinding wheel prepared from same

The invention relates to a binding agent which comprises the following raw materials in percentage by mass: 25-50% of thermosetting epoxy resin powder, 5-10% of short fibers, 20-40% of a thermoplastic elastomer, 5-25% of aerogel powder and 2-15% of a foaming agent. The invention further provides a superfine diamond grinding wheel containing the binding agent, and the superfine diamond grinding wheel is prepared by mixing the binding agent and diamond according to the mass ratio of 3: 7-5: 5. The superfine diamond grinding wheel can meet the requirement for high smoothness of existing semiconductor wafer materials and ultrathin liquid crystal glass panel materials. The surface quality is high; and the precision is high. 本发明涉及一种结合剂，其包括下述质量百分比的原料：热固性环氧树脂粉25-50%、短纤维5-10%、热塑性弹性体20-40%、气凝胶粉末5-25%、发泡剂2%-15%。本发明还提供了一种含所述结合剂的超细金刚石砂轮，其将结合剂和金刚石按质量比3:7-5:5混料，制备获得。该超细金刚石砂轮能够满足现有半导体晶圆材料及超薄液晶玻璃面板材料的高光洁度。高表面质量、高精度等加工要求。