Semiconductor device, power conversion device, and moving object

In order to solve such a problem, the purpose of the present invention is to provide a semiconductor device capable of reducing costs. A semiconductor device according to the present invention includes: a base plate; an insulating substrate disposed on the base plate; a semiconductor chip disposed on the insulating substrate; a first resin case and a second resin case which are mounted on the base plate so as to accommodate the insulating substrate and the semiconductor chip therein, and which are fitted to each other; and a sealing material that seals the insulating substrate and the semiconductor chip, and the first resin case and the second resin case are configured from resin materials having different relative tracking indexes. 本发明是为了解决这样的问题而提出的，其目的在于提供一种能够降低成本的半导体装置。本发明涉及的半导体装置具有：基座板；绝缘基板，其设置于基座板之上；半导体芯片，其设置于绝缘基板之上；第1树脂壳体以及第2树脂壳体，它们以将绝缘基板以及半导体芯片收容在内部的方式安装于基座板，二者彼此嵌合；以及封装材料，其对绝缘基板以及半导体芯片进行封装，第1树脂壳体以及第2树脂壳体由相对漏电起痕指数不同的树脂材料构成。