Heat dissipation piece structure and applicable electronic module thereof

The invention provides a heat dissipation piece structure and an electronic module with the heat dissipation piece structure. The heat dissipation piece structure is assembled and connected with the circuit board, and the upper surface of the circuit board bears the electronic assembly. The heat dis...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FENG YANGGUI, CHEN SHAOJUN, CHANG XUELIANG, LU SHENGLI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!