Heat dissipation piece structure and applicable electronic module thereof
The invention provides a heat dissipation piece structure and an electronic module with the heat dissipation piece structure. The heat dissipation piece structure is assembled and connected with the circuit board, and the upper surface of the circuit board bears the electronic assembly. The heat dis...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a heat dissipation piece structure and an electronic module with the heat dissipation piece structure. The heat dissipation piece structure is assembled and connected with the circuit board, and the upper surface of the circuit board bears the electronic assembly. The heat dissipation piece structure comprises a plate body, an extension foot and a fixing part, the board body comprises a heat dissipation area, a first face and a second face, the first face and the second face are opposite, the circuit board faces the second face, the heat dissipation area is located on the second face, and the top face of the electronic assembly on the circuit board is connected with the heat dissipation area. The extension foot extends from the second surface of the board body in a direction away from the first surface, and comprises a first contact surface connected with the upper surface of the circuit board. The fixing part extends from the second surface of the board body in a direction away from th |
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