Preparation method of printed circuit board

The invention provides a preparation method of a printed circuit board. The preparation method comprises the following steps: providing a first press-fit structure and a second press-fit structure; forming a heat-conducting hole in the first press-fit structure, wherein the length of the heat-conducting hole is equal to the thickness of the first press-fit structure; forming a plurality of heat dissipation holes in the second press-fit structure, wherein the length of the heat dissipation holes is equal to the thickness of the second press-fit structure; the first press-fit structure and the second press-fit structure are fixed through a heat conduction glue layer, so that the first press-fit structure, the heat conduction glue layer and the second press-fit structure are arranged in a stacked mode in the first direction, and at least part of the heat dissipation holes are correspondingly formed in the heat conduction holes; forming a heat-conducting piece in the heat-conducting hole, wherein the heat-conduct