Packaging heat dissipation cover and packaging structure

The invention provides a packaging heat dissipation cover and a packaging structure, the packaging heat dissipation cover comprises a top cover and a side cover, the side cover surrounds the top cover and is connected with the top cover to form a groove, and the side cover inclines towards the outer...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	QIAN KAIYOU, XUE YUTING
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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