Packaging heat dissipation cover and packaging structure
The invention provides a packaging heat dissipation cover and a packaging structure, the packaging heat dissipation cover comprises a top cover and a side cover, the side cover surrounds the top cover and is connected with the top cover to form a groove, and the side cover inclines towards the outer...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a packaging heat dissipation cover and a packaging structure, the packaging heat dissipation cover comprises a top cover and a side cover, the side cover surrounds the top cover and is connected with the top cover to form a groove, and the side cover inclines towards the outer side of the groove; the inner side of the side cover is provided with at least one preset area, and the preset area is recessed in the surface of the side cover around the preset area, so that when the packaging heat dissipation cover is applied to the packaging structure, a larger longitudinal space is formed between the preset area of the side cover and a packaging substrate of the packaging structure, and the part, corresponding to the preset area, of the packaging substrate can be used for arranging a device; and a device with a relatively high height is arranged.
本申请提供了一种封装散热盖以及封装结构,该封装散热盖包括:顶盖和侧盖,侧盖环绕顶盖,并与顶盖相接,形成凹槽,侧盖向凹槽的外侧倾斜;侧盖内侧具有至少一个预设区,该预设区凹陷于其周围的侧盖表面,从而当该封装散热盖应用于封装结构时,侧盖的预设区与封装结构的封装基板之间具有更大的纵向空间,使得封装基板与 |
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