Organosilicon conformal coating for flexible circuit board as well as preparation method and application thereof
The invention discloses an organic silicon conformal coating for a flexible circuit board as well as a preparation method and application of the organic silicon conformal coating. The organosilicon conformal coating is prepared from the following components in parts by weight: 5 to 7 parts of adhesi...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses an organic silicon conformal coating for a flexible circuit board as well as a preparation method and application of the organic silicon conformal coating. The organosilicon conformal coating is prepared from the following components in parts by weight: 5 to 7 parts of adhesive, 43 to 47 parts of low-viscosity vinyl-terminated poly (dimethyl siloxane), 40 to 41 parts of vinyl-terminated poly (dimethyl siloxane), 7 to 9 parts of end-side hydrogen-containing silicone oil, 0.03 to 0.07 part of inhibitor, and 0.1 to 0.2 part of single-component platinum catalyst. According to the invention, the tertiary amine pyridine ring is grafted to the methyl vinyl MQ type silicon resin, and is fused into an organic silicon skeleton structure in a chemical linking manner through a hydrosilylation manner, so that the bonding of the adhesive tertiary amine pyridine ring to the polyimide film of the flexible circuit board is firmer. The organosilicon conformal coating is colorless, transparent, solvent-f |
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