Laser cutting device

The invention belongs to the technical field of laser cutting, and discloses a laser cutting device which comprises a rack, a pressing block and a cutting assembly, a to-be-cut workpiece is placed on a cutting platform of the rack, the pressing block is slidably arranged on the rack in the vertical...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: JANG, HYE-YOUNG, WEI LAI, HUANG ZHAOBIAO, SHE YANGTENG, CHEN HUACHAO, LIAO CHENGJIU, WU SHUNING, CHEN YONGZHI, LI YONGXIANG, WANG WEICONG, ZHU HUILIANG, XIAO HU, ZHONG SENMIAO, LAI WEIBIN, LIN GUANGYIN, PENG ZHONGWEN, CHEN XIAOGUANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention belongs to the technical field of laser cutting, and discloses a laser cutting device which comprises a rack, a pressing block and a cutting assembly, a to-be-cut workpiece is placed on a cutting platform of the rack, the pressing block is slidably arranged on the rack in the vertical direction and placed on the upper surface of the to-be-cut workpiece, and the cutting assembly is slidably arranged on the rack in the vertical direction and placed on the upper surface of the to-be-cut workpiece. The cutting assembly is used for conducting laser cutting on the upper surface of a to-be-cut workpiece placed on the cutting platform, the cutting assembly is in transmission connection with the pressing block, when the pressing block slides in the vertical direction, the pressing block can drive the cutting assembly to slide in the vertical direction, and the sliding direction of the pressing block is opposite to that of the cutting assembly, so that when the thickness of the to-be-cut workpiece changes