Test board for semiconductor test and manufacturing process thereof

The invention relates to the technical field of semiconductor test boards, in particular to a test board for semiconductor test and a manufacturing process thereof, and the test board for semiconductor test comprises a test board main body and heat dissipation columns; the test board main body comprises a plurality of layers of core boards and a plurality of layers of prepregs, and a prepreg is arranged between every two adjacent layers of core boards; the test board main body is provided with through holes penetrating through the core boards and the prepregs, the inner side walls, facing the through holes, of the core boards are obliquely arranged outwards, and the inner side walls of the core boards and the inner side walls of the prepregs form a continuous step shape, so that the through holes are in a shape with wide upper parts and narrow lower parts; a plurality of protruding rods extending in the radial direction of the heat dissipation column are arranged on the peripheral side of the heat dissipation