Capacitor having conductive layer coupled to metal layer of capacitor

Embodiments described herein may relate to devices, processes, and techniques related to MIM capacitors having a multi-trench structure to increase charge density, where the dielectric of the MIM capacitor includes a perovskite-based material. In embodiments, the first conductive layer may be couple...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	CHANG SHUUNG, SENGUPTA AYAN, YOUNG IAN A, LIN CHUNIEH, OGUZ KAAN, METZ MATTHEW V, DENG IN, AVCI UYGAR E, LI, SHIPENG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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