Motor chip heat dissipation structure

The invention relates to a heat dissipation structure of a motor chip. The heat dissipation structure comprises a control circuit board; a plurality of motor chips are arranged on the control circuit board; the motor chip heat dissipation structure further comprises an upper shell, a first heat dissipation substrate, a second heat dissipation substrate and a plurality of heat conduction insulation gaskets. The control circuit board is arranged in the upper shell; the first heat dissipation substrate and the second heat dissipation substrate are in contact for heat conduction; a through hole is formed in the upper shell; the whole body formed by the first heat dissipation substrate and the second heat dissipation substrate passes through the through hole; a plurality of heat dissipation bosses are arranged on the second heat dissipation substrate; the first heat dissipation substrate is provided with a plurality of heat dissipation fins used for transferring heat into air. The heat of the motor chip located in