Multi-line switching lead bonding method based on manual wedge-shaped bonding machine

Multi-line switching lead bonding method based on manual wedge-shaped bonding machine

The invention relates to a multi-line switching lead bonding method based on a manual wedge-shaped bonding machine, and relates to the technical field of electronic packaging. The method comprises the following steps: inputting a first lead corresponding to a first-type linear chip into a multi-line...

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Hauptverfasser: HAN LIUJUN, YAN XIAOJIE, SUN WEI, CHENG ZHIYUAN, WANG SHIQUAN
Format: Patent
Sprache:chi ; eng
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator HAN LIUJUN
YAN XIAOJIE
SUN WEI
CHENG ZHIYUAN
WANG SHIQUAN
description The invention relates to a multi-line switching lead bonding method based on a manual wedge-shaped bonding machine, and relates to the technical field of electronic packaging. The method comprises the following steps: inputting a first lead corresponding to a first-type linear chip into a multi-linear manual wedge-shaped bonding machine; executing a bonding program so as to carry out bonding of the first type of linear chips; responding to bonding completion of the first type of linear chips; leading wires corresponding to the second type of linear chips are input into a multi-linear manual wedge-shaped bonding machine; executing a bonding program so as to carry out bonding of the second type of linear chips; and drawing the second lead out of the multi-line manual wedge-shaped bonding machine. A multi-linear manual wedge-shaped bonding machine is applied, a corresponding bonding program is configured, and in the process of bonding different types of linear chips, the process of bonding multiple types of line
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Multi-line switching lead bonding method based on manual wedge-shaped bonding machine
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