Multi-line switching lead bonding method based on manual wedge-shaped bonding machine

The invention relates to a multi-line switching lead bonding method based on a manual wedge-shaped bonding machine, and relates to the technical field of electronic packaging. The method comprises the following steps: inputting a first lead corresponding to a first-type linear chip into a multi-linear manual wedge-shaped bonding machine; executing a bonding program so as to carry out bonding of the first type of linear chips; responding to bonding completion of the first type of linear chips; leading wires corresponding to the second type of linear chips are input into a multi-linear manual wedge-shaped bonding machine; executing a bonding program so as to carry out bonding of the second type of linear chips; and drawing the second lead out of the multi-line manual wedge-shaped bonding machine. A multi-linear manual wedge-shaped bonding machine is applied, a corresponding bonding program is configured, and in the process of bonding different types of linear chips, the process of bonding multiple types of line