PHOTOSENSITIVE RESIN COMPOSITION, PHOTOCURED PRODUCT OF SAID COMPOSITION, AND PRINTED WIRING BOARD COATED WITH SAID COMPOSITION

The invention provides a photosensitive resin composition, a photocured product of the composition, and a printed wiring board coated with the composition. The photosensitive resin composition can obtain the photocured product with excellent long-term insulation reliability and matte appearance. The...

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Bibliographische Detailangaben
Hauptverfasser:	TSURU HIROKI, HASEGAWA YASUYUKI, HARASHIMA KEITA, TSURUMAKI TAKAHIRO, HAYASHI MARIKA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CINEMATOGRAPHY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	The invention provides a photosensitive resin composition, a photocured product of the composition, and a printed wiring board coated with the composition. The photosensitive resin composition can obtain the photocured product with excellent long-term insulation reliability and matte appearance. The photosensitive resin composition contains (A) a photosensitive resin, (B) a photopolymerization initiator, (C) a reactive diluent, (D) an epoxy compound, (E) a filler, and (F) a matte agent surface-treated with an organosilicon compound. 本发明提供一种感光性树脂组合物、该组合物的光固化物以及涂布有该组合物的印刷配线板，所述感光性树脂组合物能够获得长期绝缘可靠性优异、且具有哑光外观的光固化物。感光性树脂组合物含有(A)感光性树脂、(B)光聚合引发剂、(C)反应性稀释剂、(D)环氧化合物、(E)填料以及(F)利用有机硅化合物进行了表面处理的哑光剂。