Method for detecting damage of copper-plated seed layer to blue film and influence of copper-plated seed layer on electrical property

The invention provides a method for detecting damage of a copper-plated seed layer to a blue film. The method comprises the following steps: providing a first blue film sheet and a second blue film sheet; testing the gray scale of a first transparent conductive oxide thin film in the second blue diaphragm to obtain a first gray scale value; placing the first blue diaphragm and the second blue diaphragm in the same chamber in an overlapping manner; respectively preparing a first copper seed layer on the first blue membrane and a second copper seed layer on the second blue membrane by adopting a physical vapor deposition process; testing the gray scale of the first transparent conductive oxide thin film in the second blue diaphragm again to obtain a second gray scale value; and judging whether the first blue diaphragm is damaged or not by comparing the second gray value with the first gray value. The method can detect the damage of the copper seed layer to the blue film. The invention further provides a method