System and method for temperature sensing using thermopile integrated with rigid printed circuit board

The present disclosure relates to systems and methods for temperature sensing using a thermopile integrated with a rigid printed circuit board. Robust estimation of temperatures inside and outside the device may be achieved using one or more absolute temperature sensors, optionally in combination wi...

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Hauptverfasser: CHU XINSHENG, KARAKI HABIB S, GAO JIANGANG, MEHRA SAURABH, CHOU, FRANK, Y, BUCHHOLZ JOHN W, LABOWAY, DALE, W, HUANG, LAY, H, HUANG WANFENG, LIN JIAXIAN, LEE JOSHUA ROBERT, TANG SHERRY, TADLEY, WILLIAM, H, CHEN ERIC, ZHANG LEILEI, CLEMENTS JEREMY CHARLES, HAN CHIN SAN, C. C. DE SOUSA, CHEN HONGLING, HUANG GUOZHEN, HEADLEY JAMES A, AMIN AKSHAY M
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The present disclosure relates to systems and methods for temperature sensing using a thermopile integrated with a rigid printed circuit board. Robust estimation of temperatures inside and outside the device may be achieved using one or more absolute temperature sensors, optionally in combination with thermopile heat flux sensors. A thermopile temperature sensing system may measure a temperature gradient across two locations within the device to estimate absolute temperature at locations that are not practical using an absolute temperature sensor to measure. Using a heat flux model associated with the device, the thermopile temperature sensing system may be used to estimate a temperature associated with an object contacting an exterior surface of the device, such as a skin temperature of a user. In addition, the thermopile temperature sensing system may be used to estimate ambient air temperature. Within the device, temperature measurements from the thermopile temperature sensor may be used to compensate for