Waterproof and moistureproof conductive adhesive film for microelectronic packaging and preparation method of waterproof and moistureproof conductive adhesive film

The invention discloses a waterproof and moistureproof conductive adhesive film for microelectronic packaging and a preparation method thereof. The waterproof and moistureproof conductive adhesive film comprises a release layer, a conductive film is arranged on the release layer, grooves are formed...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	QIAN LI, CAO JUNSHAN, SONG TAO, WANG HAO
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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