Waterproof and moistureproof conductive adhesive film for microelectronic packaging and preparation method of waterproof and moistureproof conductive adhesive film

The invention discloses a waterproof and moistureproof conductive adhesive film for microelectronic packaging and a preparation method thereof. The waterproof and moistureproof conductive adhesive film comprises a release layer, a conductive film is arranged on the release layer, grooves are formed in the release layer at equal intervals, and protrusions matched with the grooves are arranged below the conductive film at equal intervals. The epoxy resin is modified, the toughness of the epoxy resin is improved, and the epoxy resin is uniformly dispersed in the epoxy resin in a proper particle size and an ideal form, so that the curing effect in subsequent use can be facilitated, cracks are prevented, on one hand, the use performance can be improved, and on the other hand, the water resistance and the moisture resistance can be improved. 本发明公开了一种微电子封装用耐水防潮的导电胶膜及其制备方法，包括离型层，所述离型层上设有导电膜，并且所述离型层上等距开设有凹槽，所述导电膜下等距设有与所述凹槽相匹配的凸起。本发明通过对环氧树脂进行改性，通过增加环氧树脂的韧性，以合适的粒径及理想的形态均匀分散于环氧树脂中，可方便后续在使用时的固化效果，防止出现裂纹，一方面可提高使用性能，另一方面还可提