Method for modifying SAC/Cu welding spot interface by using nano Cu6Sn5 phase and detecting SAC/Cu welding spot interface

According to the method for modifying the SAC/Cu welding spot interface through the nanometer Cu6Sn5 phase and detecting the nanometer Cu6Sn5 phase, nanometer Cu6Sn5 particles are firstly prepared, then Sn3. 0Ag0. 5Cu and the nanometer Cu6Sn5 particles are evenly mixed, then ultrasonic concussion is...

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Hauptverfasser: YANG, HONGWEI, BAI HAILONG, WANG BIAO, LENG MANXI, ZHANG HONGYU, YAN JIKANG, ZHAO JIANHUA, ZHAO LINGYAN, LIANG HUAXIN
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creator YANG, HONGWEI
BAI HAILONG
WANG BIAO
LENG MANXI
ZHANG HONGYU
YAN JIKANG
ZHAO JIANHUA
ZHAO LINGYAN
LIANG HUAXIN
description According to the method for modifying the SAC/Cu welding spot interface through the nanometer Cu6Sn5 phase and detecting the nanometer Cu6Sn5 phase, nanometer Cu6Sn5 particles are firstly prepared, then Sn3. 0Ag0. 5Cu and the nanometer Cu6Sn5 particles are evenly mixed, then ultrasonic concussion is further conducted, the Sn3. 0Ag0. 5Cu-Cu6Sn5x welding flux alloy is more evenly mixed, and the modified Sn3. 0Ag0. 5Cu-Cu6Sn5x welding flux alloy is obtained. The method comprises the following steps of: removing surface oxides from a PCB (Printed Circuit Board), then mounting a Sn3. 0Ag0. 5Cu-Cu6Sn5x alloy on a PCB substrate, then carrying out reflow soldering treatment, and then carrying out aging treatment. On the basis that the original performance of the solder is not changed, the Sn3. 0Ag0. 5Cu lead-free solder is enhanced through the nano Cu6Sn5 phase, growth of an IMC layer is inhibited, and the reliability of a welding spot can be effectively improved. 利用纳米Cu6Sn5相改性SAC/Cu焊点界面及检测的方法,先制备得到纳米Cu6Sn5颗粒,再将Sn3.0
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The method comprises the following steps of: removing surface oxides from a PCB (Printed Circuit Board), then mounting a Sn3. 0Ag0. 5Cu-Cu6Sn5x alloy on a PCB substrate, then carrying out reflow soldering treatment, and then carrying out aging treatment. 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The method comprises the following steps of: removing surface oxides from a PCB (Printed Circuit Board), then mounting a Sn3. 0Ag0. 5Cu-Cu6Sn5x alloy on a PCB substrate, then carrying out reflow soldering treatment, and then carrying out aging treatment. On the basis that the original performance of the solder is not changed, the Sn3. 0Ag0. 5Cu lead-free solder is enhanced through the nano Cu6Sn5 phase, growth of an IMC layer is inhibited, and the reliability of a welding spot can be effectively improved. 利用纳米Cu6Sn5相改性SAC/Cu焊点界面及检测的方法,先制备得到纳米Cu6Sn5颗粒,再将Sn3.0</abstract><oa>free_for_read</oa></addata></record>
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subjects ALLOYS
CASTING
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
FERROUS OR NON-FERROUS ALLOYS
GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MACHINE TOOLS
MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS
MAKING METALLIC POWDER
MANUFACTURE OF ARTICLES FROM METALLIC POWDER
MEASURING
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
METALLURGY OF IRON
MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS
PERFORMING OPERATIONS
PHYSICS
POWDER METALLURGY
SOLDERING OR UNSOLDERING
TESTING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
WORKING METALLIC POWDER
title Method for modifying SAC/Cu welding spot interface by using nano Cu6Sn5 phase and detecting SAC/Cu welding spot interface
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