Method for modifying SAC/Cu welding spot interface by using nano Cu6Sn5 phase and detecting SAC/Cu welding spot interface

According to the method for modifying the SAC/Cu welding spot interface through the nanometer Cu6Sn5 phase and detecting the nanometer Cu6Sn5 phase, nanometer Cu6Sn5 particles are firstly prepared, then Sn3. 0Ag0. 5Cu and the nanometer Cu6Sn5 particles are evenly mixed, then ultrasonic concussion is...

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Bibliographische Detailangaben
Hauptverfasser:	YANG, HONGWEI, BAI HAILONG, WANG BIAO, LENG MANXI, ZHANG HONGYU, YAN JIKANG, ZHAO JIANHUA, ZHAO LINGYAN, LIANG HUAXIN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ALLOYS CASTING CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS GENERAL DEVICES FOR HEAT TREATMENT OF FERROUS OR NON-FERROUSMETALS OR ALLOYS INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MACHINE TOOLS MAKING METAL MALLEABLE BY DECARBURISATION, TEMPERING OR OTHERTREATMENTS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MEASURING METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY METALLURGY OF IRON MODIFYING THE PHYSICAL STRUCTURE OF FERROUS METALS PERFORMING OPERATIONS PHYSICS POWDER METALLURGY SOLDERING OR UNSOLDERING TESTING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM WORKING METALLIC POWDER
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Zusammenfassung:	According to the method for modifying the SAC/Cu welding spot interface through the nanometer Cu6Sn5 phase and detecting the nanometer Cu6Sn5 phase, nanometer Cu6Sn5 particles are firstly prepared, then Sn3. 0Ag0. 5Cu and the nanometer Cu6Sn5 particles are evenly mixed, then ultrasonic concussion is further conducted, the Sn3. 0Ag0. 5Cu-Cu6Sn5x welding flux alloy is more evenly mixed, and the modified Sn3. 0Ag0. 5Cu-Cu6Sn5x welding flux alloy is obtained. The method comprises the following steps of: removing surface oxides from a PCB (Printed Circuit Board), then mounting a Sn3. 0Ag0. 5Cu-Cu6Sn5x alloy on a PCB substrate, then carrying out reflow soldering treatment, and then carrying out aging treatment. On the basis that the original performance of the solder is not changed, the Sn3. 0Ag0. 5Cu lead-free solder is enhanced through the nano Cu6Sn5 phase, growth of an IMC layer is inhibited, and the reliability of a welding spot can be effectively improved. 利用纳米Cu6Sn5相改性SAC/Cu焊点界面及检测的方法，先制备得到纳米Cu6Sn5颗粒，再将Sn3.0