Isolator and chip

The embodiment of the invention provides an isolator and a chip. The isolator comprises an insulating substrate, a first inductance layer and a second inductance layer. A first binding pad of the first inductance layer is electrically connected with the first conductive coil, and the first binding pad and the first conductive coil are arranged on the same side of the insulating substrate; a second binding pad of the second inductance layer is electrically connected with the second conductive coil, and the second binding pad and the second conductive coil are arranged on the same side of the insulating substrate; wherein the first inductance layer and the second inductance layer are respectively arranged on two opposite sides of the insulating substrate; the isolator comprises at least two first via holes, at least part of the first binding bonding pad is exposed by the first via holes in the thickness direction of the isolator, and at least part of the second binding bonding pad is exposed by the first via ho