Mounting substrate for semiconductor package and semiconductor package

The invention provides a mounting substrate for a semiconductor package and the semiconductor package. The mounting substrate includes: a substrate having an upper surface and a lower surface opposite to each other, the substrate including a plurality of insulating layers and wirings respectively located in the plurality of insulating layers; a first substrate pad and a second substrate pad on the upper surface in a chip mounting area of the mounting substrate; a heat absorbing pad on the upper surface in a peripheral region of the mounting substrate adjacent to the chip mounting region; and a connecting line in the substrate, the connecting line being configured to thermally couple the heat absorbing pad and the second substrate pad to each other. 提供了用于半导体封装件的安装基板和半导体封装件。所述安装基板包括：具有彼此相对的上表面和下表面的基板，所述基板包括多个绝缘层和分别位于所述多个绝缘层中的布线；第一基板焊盘和第二基板焊盘，在所述安装基板的芯片安装区域中位于所述上表面上；吸热焊盘，在所述安装基板的与所述芯片安装区域相邻的外围区域中位于所述上表面上；以及位于所述基板中的连接线，所述连接线被配置为将所述吸热焊盘和所述第二基板焊盘彼此导热地结合。