Semiconductor packaging structure and packaging method

The invention discloses a semiconductor packaging structure and a packaging method, relates to the technical field of semiconductor packaging, and is used for solving the problems that after a cover plate and an aluminum nitride ceramic cooling fin are closed, filled epoxy resin absorbs water vapor in air in a humid environment, and after a device is heated, the water vapor is evaporated, so that the reliability of the device is improved. The aluminum nitride ceramic heat dissipation chip comprises a chip body, a cover plate and an aluminum nitride ceramic heat dissipation sheet, part of heat, which cannot be discharged from the aluminum nitride ceramic cooling fin, on the chip body is discharged to the cover plate through the cooling plate, the overall cooling effect of the whole chip is improved, meanwhile, the cooling ring installed on the cooling plate is clamped with the cooling layer installed on the cover plate, the cooling area of the whole cooling plate is increased, and the cooling effect of the who