Packaging structure and manufacturing method thereof
The invention discloses a packaging structure and a manufacturing method thereof, and relates to the technical field of packaging, and the method comprises the steps: manufacturing a preset number of metal columns, each metal column comprises a first end part and a second end part; the preset number...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention discloses a packaging structure and a manufacturing method thereof, and relates to the technical field of packaging, and the method comprises the steps: manufacturing a preset number of metal columns, each metal column comprises a first end part and a second end part; the preset number of anti-overflow rubber rings are manufactured; the first end parts of the metal columns are welded on a substrate to be packaged, and the anti-overflow rubber rings are correspondingly arranged on the second end parts of the metal columns in a penetrating manner; the to-be-packaged substrate welded with the metal columns is placed in a packaging mold, the lower surface of each anti-overflow rubber ring is attached to the packaging mold, and the packaging mold exposes the welding part of the second end part; injecting a packaging material into the packaging mold to form a packaging structure; the lower surface of the anti-overflow rubber ring is tightly attached to the inner wall of the packaging mold, a gap betwe |
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