Silicon-based MEMS (Micro Electro Mechanical System) process and multi-physics field coupled device performance evaluation method

The invention discloses a silicon-based MEMS process and multi-physics field coupled device performance evaluation method, which comprises the following steps of: performing manufacturing process simulation on a device with a silicon-based MEMS substrate to obtain a process simulation model; perform...

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Hauptverfasser: GUO YANGKUAN, DUANMU ZHENG, WAN CAIXIN, LYU SIYUAN, GUO JUNWEI, WANG YINING, ZHANG XIAOQING
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention discloses a silicon-based MEMS process and multi-physics field coupled device performance evaluation method, which comprises the following steps of: performing manufacturing process simulation on a device with a silicon-based MEMS substrate to obtain a process simulation model; performing structure design topology on the process simulation model to obtain a three-dimensional model after topology reconstruction; establishing a process and design coupling model based on the three-dimensional model after topology reconstruction, and determining a physical field during coupling based on a coupling physical environment; carrying out multi-physics field numerical simulation calculation; and performing device performance evaluation based on a simulation calculation result. According to the method, the problem of coupling of the MEMS manufacturing process and the geometric configuration is solved, the structure and the manufacturing process of the MEMS device can be optimized through innovative numerica