Bismaleimide-modified polyphenylene ether resin, manufacturing method thereof and substrate material

The invention discloses a bismaleimide modified polyphenyl ether resin, a manufacturing method thereof and a substrate material. The chemical structure of the bismaleimide modified polyphenyl ether resin is as follows: R represents a chemical group between two hydroxyphenyl functional groups of a bisphenol compound, and n is an integer between 3 and 25. Therefore, the functional group modified polyphenyl ether resin has good compatibility and processability, and can simultaneously retain the excellent electrical characteristics (such as insulativity, acid and alkali resistance, dielectric constant and dielectric loss) of the polyphenyl ether resin material. 本发明公开一种双马来酰亚胺修饰的聚苯醚树脂、其制造方法及基板材料。双马来酰亚胺修饰的聚苯醚树脂的化学结构如下：R代表一双酚类化合物的位于其两个羟苯基官能团之间的化学基团，并且n是介于3至25之间的整数。借此，经官能基修饰的聚苯醚树脂具有良好的兼容性及加工性，并且能同时保留有聚苯醚树脂材料本身优异的电气特性(如：绝缘性、耐酸碱性、介电常数、及介电损耗)。