Workpiece separation device and workpiece separation method

Workpiece separation device and workpiece separation method

The invention provides a workpiece separating apparatus and a workpiece separating method, which can easily peel a support body from a solidification layer by performing selective light irradiation on a local joint part of the support body and the solidification layer. The workpiece separating devic...

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Hauptverfasser: TOMIOKA KYOHEI, OHTANI, YOSHIKAZU
Format: Patent
Sprache:chi ; eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator TOMIOKA KYOHEI
OHTANI, YOSHIKAZU
description The invention provides a workpiece separating apparatus and a workpiece separating method, which can easily peel a support body from a solidification layer by performing selective light irradiation on a local joint part of the support body and the solidification layer. The workpiece separating device is characterized in that the workpiece separating device is provided with the following components: a holding component which holds any one of a workpiece side of a laminated body and a supporting body in a free assembling and disassembling manner; a light irradiation unit that irradiates light toward the separation layer through the other one of the support body and the workpiece side of the laminate held by the holding member; an isolation member that moves either the workpiece side of the laminated body or the support body in an isolated manner in the thickness direction; and a control unit for controlling the operation of the light irradiation unit and the isolation member, the laminated body having: a separa
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title Workpiece separation device and workpiece separation method
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