Detection method and device based on solder paste on circuit board and storage medium

The invention discloses a detection method and device based on solder paste on a circuit board and a storage medium. The method comprises the steps that the plane coordinates of a circuit board standard CAD drawing, the plane coordinates of a whole circuit board 2D image and the space coordinates of...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHENG KELIN, ZHANG ZHEN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention discloses a detection method and device based on solder paste on a circuit board and a storage medium. The method comprises the steps that the plane coordinates of a circuit board standard CAD drawing, the plane coordinates of a whole circuit board 2D image and the space coordinates of a whole circuit board 3D point cloud are obtained and aligned to the same coordinate system; obtaining a 2D image of a detection area where the current solder paste position is located from the 2D image of the whole circuit board; rGB color extraction is carried out on the 2D image of the detection area, and current solder paste is extracted; and respectively calculating the position offset, the area and the volume of the current solder paste through the 2D image and the 3D point cloud of the current solder paste. According to the invention, the solder paste on the whole circuit board can be detected, so that the detection efficiency is improved; through the 2D image and the 3D point cloud of the solder paste, the