Surface selective atomic layer deposition method using pre-bonding method

The invention belongs to the field of optical and semiconductor manufacturing, and relates to the field of optical coating, in particular to a surface selective atomic layer deposition method using a pre-bonding method. The method comprises the following steps: providing a functional glass element a...

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Hauptverfasser: SHEN FANFAN, WEI DONGMENG, YANG JINHUI, PU WENXUAN, LIU RUI, XU QIWEI, FENG JICUN, LI QING, LI KAIYU, WANG QIAO, LYU XUELIANG, CHU MIAO
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention belongs to the field of optical and semiconductor manufacturing, and relates to the field of optical coating, in particular to a surface selective atomic layer deposition method using a pre-bonding method. The method comprises the following steps: providing a functional glass element and a bonding auxiliary element, carrying out surface polishing treatment on a to-be-protected surface of the functional glass element and a protective surface of the bonding auxiliary element, attaching the to-be-protected surface to the protective surface, carrying out pre-bonding treatment until no bubble is generated at the edge of the attached surface of the to-be-protected surface and the protective surface, and carrying out atomic layer deposition to obtain the functional glass element. Performing debonding after atomic layer deposition; wherein a direct bonding method is adopted in the pre-bonding treatment, and the pressure of 0.05-0.1 MPa is applied in the direct bonding method. The method provided by the