Semiconductor device and semiconductor module

A semiconductor device having a fan-out package structure is provided with: a semiconductor element (11) having a first electrode pad (111) and a second electrode pad (112) on a surface (11a); a sealing material (12) which is made of an insulating resin material and covers a side surface (11c) connecting the front surface and the back surface (11b) of the semiconductor element; and a rewiring layer (13) covering the surface of the semiconductor element and a part of the encapsulant. The rewiring layer has: an insulating layer (131) comprising an insulating resin material; a first rewiring line (132), at least a part of which is disposed on the boundary between the side surface of the semiconductor element and the encapsulant; and a second rewiring (133) electrically connected to the second electrode pad, at least a portion of the second rewiring extending to the outside of the outer contour of the semiconductor element across the first rewiring, and electrically independent from the first rewiring. 一种扇出型封装构造的