Semiconductor device and forming method thereof

Embodiments provide regulated power routing through various non-active components of the device. In one embodiment, such an inactive component includes a via wall that may be formed in an encapsulation material of a die stack. In another embodiment, such an inactive component includes a heat dissipation component formed over the die stack. In another embodiment, such an inactive component includes a dummy via block attached adjacent to a die multi-dimensional data set. Still other embodiments may combine the components of these embodiments without limitation. The embodiment of the invention also relates to a semiconductor device and a forming method thereof. 实施例通过器件的各个非有源部件提供稳压电源布线。在一个实施例中，这样的非有源部件包括可以形成在管芯堆叠件的密封材料中的通孔壁。在另一个实施例中，这样的非有源部件包括形成在管芯堆叠件上方的散热部件。在另一个实施例中，这样的非有源部件包括与管芯多维数据集相邻附接的伪通孔块。又一些其它实施例可以无限制地组合这些实施例的部件。本申请的实施例还涉及半导体器件及其形成方法。