Integrated circuit and electronic device

The embodiment of the invention provides an integrated circuit and electronic equipment. The integrated circuit includes a molding compound, a plurality of pins, an exposed bonding pad, a chip surrounded by the molding compound, an adhesive material, and a plurality of bonding wires. The plurality of pins are disposed on at least one edge of the molding compound and are separated from each other. The adhesive material is provided between the chip and the bare bonding pad, and is surrounded by the molding compound. The bare bonding pad is electrically connected to the chip via one of the plurality of bonding wires, and the plurality of pins are electrically connected to the chip via the remaining plurality of bonding wires. The chip is configured to detect whether there is a chassis intrusion event in response to a signal from the bare bond pad. 本发明实施例提供一种集成电路和电子设备。集成电路包括一模制化合物、多个引脚、一裸露接合垫、被上述模制化合物所包围的一芯片、一粘着材料和多个结合线。上述多个引脚设置在上述模制化合物的至少一边缘上并且彼此分离。上述粘着材料设置在上述芯片和上述裸露接合垫之间，并被上述模制化合物所包围。上述裸露接合垫是经由上述多个结合线的一者而电连接至上述