SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD USING THE SAME

The present invention provides a substrate processing apparatus that performs a process under a lower pressure condition to secure stability, and a substrate processing method using the same. The substrate processing apparatus includes: a chamber into which a substrate in which a rinsing liquid remains is carried, the chamber including a housing and a processing region; a supply port provided in the housing and supplying a first drying gas and a second drying gas to the processing region; a first supply line, which is connected to the supply port, and in which the first drying gas moves; and a second supply line connected to the supply port and in which the second dry gas moves, in which the first dry gas is a gas having a temperature lower than a first temperature and the second dry gas is a gas having a temperature higher than the first temperature, and the second drying gas is used for drying the flushing liquid remaining on the substrate. 本发明提供在更低的压力条件下执行工艺以确保稳定性的基板处理装置及利用其的基板处理方法。所述基板处理装置包括：腔室，残留有冲洗液的基板被