Thermal design method based on high-power-density PCB

The invention provides a thermal design method based on a high-power-density PCB, and the method comprises the steps: firstly building a power loss mathematical model of a heat source on the PCB, and building a PCB thermal simulation model according to the power loss mathematical model; secondly, performing chip-level, board-level and system-level thermal analysis on the PCB according to a thermal simulation result; then, according to a thermal analysis result, thermal-structure improvement is carried out on the PCB, and the power density of the PCB is improved while the heat dissipation capacity is ensured; and finally, adding a heat dissipation device corresponding to a heat source on the improved PCB, and optimizing the structural parameters of the heat dissipation device through a genetic algorithm. According to the method, a heat source power loss mathematical model is specifically established, three-level combined thermal analysis is carried out on the PCB, the structure of the PCB is adaptively improve