BONDING DEVICE, BONDING SYSTEM, AND BONDING METHOD

A bonding device (41, 41A, 41B) according to the present disclosure is used for bonding substrates. The bonding device is provided with a first holding unit (110), a second holding unit (120), a moving unit (130), a case (100), an interferometer (160, 170), a first gas supply unit (140, 140B), and a...

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Bibliographische Detailangaben
Hauptverfasser:	INAMASU TOSHIFUMI, MAKI TETSUYA
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A bonding device (41, 41A, 41B) according to the present disclosure is used for bonding substrates. The bonding device is provided with a first holding unit (110), a second holding unit (120), a moving unit (130), a case (100), an interferometer (160, 170), a first gas supply unit (140, 140B), and a second gas supply unit (180, 180A). The first holding part (110) is used for sucking and holding the first substrate (W1) from above the first substrate (W1). The second holding part (120) is used for sucking and holding the second substrate (W2) from the lower part of the second substrate (W2). The moving unit (130) moves one of the first holding unit (110) and the second holding unit (120) in the horizontal direction with respect to the other holding unit. The housing (100) accommodates the first holding part (110), the second holding part (120), and the moving part (130). The interferometers (160, 170) are disposed inside the housing (100), and measure the horizontal distance to the one holding part or the obje