Adhesive composition, adhesive sheet, laminate, and printed wiring board

The adhesive composition contains an acid-modified polyolefin (a), a phenolic resin (b) having a polycyclic structure, and an epoxy resin (c), and further contains an inorganic filler (d) and/or a flame retardant (e). Provided is an adhesive composition which not only has high adhesiveness to conventional polyimide and polyester films, but also has high adhesiveness to metal substrates and resin substrates such as liquid crystal polymers and syndiotactic polystyrene, can obtain high solder heat resistance, has excellent low dielectric properties, and has tack resistance and flame retardancy. 一种粘接剂组合物，含有酸改性聚烯烃(a)、具有多环式结构的酚醛树脂(b)及环氧树脂(c)，进一步含有无机填充剂(d)及阻燃剂(e)中的至少一者。本发明提供一种粘接剂组合物，其不仅具有与现有聚酰亚胺、聚酯膜的高粘接性，还具有与液晶聚合物、间规聚苯乙烯等树脂基材和金属基材的高粘接性，且能够得到高的焊锡耐热性，低介电特性也优异，具有耐粘性和阻燃性。