Heterojunction and preparation method and application thereof

The invention provides a heterojunction and a preparation method and application thereof, a route combining a chemical vapor deposition method and a dry transfer method is adopted, firstly, a MoS2/WS2 mixed layer is directly obtained through two-step growth by the chemical vapor deposition method, a...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: WEI QIANGMIN, HUANG JUN, YANG BING, LIU YANGBOWEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator WEI QIANGMIN
HUANG JUN
YANG BING
LIU YANGBOWEN
description The invention provides a heterojunction and a preparation method and application thereof, a route combining a chemical vapor deposition method and a dry transfer method is adopted, firstly, a MoS2/WS2 mixed layer is directly obtained through two-step growth by the chemical vapor deposition method, and then the MoS2/WS2 mixed layer is transferred to the surface of an h-BN substrate to form the heterojunction by the dry transfer technology. Or the MoS2 layer and the WS2 layer are respectively grown by adopting chemical vapor deposition, and then the MoS2 layer and the WS2 layer are transferred to the surface of the h-BN substrate in batches by utilizing a dry transfer technology to form the heterojunction, the obtained MoS2/WS2-h-BN heterojunction has excellent thermoelectric performance, the control requirement of the method on the chemical vapor deposition method is not very strict, the influence of the external environment is relatively small, and the method is suitable for industrial production. The method
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN115768230A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN115768230A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN115768230A3</originalsourceid><addsrcrecordid>eNrjZLD1SC1JLcrPKs1LLsnMz1NIzEtRKChKLUgsSgTzc1NLMvJTwMKJBQU5mckQ4ZKM1KLU_DQeBta0xJziVF4ozc2g6OYa4uyhm1qQH59aXJCYnJqXWhLv7GdoaGpuZmFkbOBoTIwaAGprMMQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Heterojunction and preparation method and application thereof</title><source>esp@cenet</source><creator>WEI QIANGMIN ; HUANG JUN ; YANG BING ; LIU YANGBOWEN</creator><creatorcontrib>WEI QIANGMIN ; HUANG JUN ; YANG BING ; LIU YANGBOWEN</creatorcontrib><description>The invention provides a heterojunction and a preparation method and application thereof, a route combining a chemical vapor deposition method and a dry transfer method is adopted, firstly, a MoS2/WS2 mixed layer is directly obtained through two-step growth by the chemical vapor deposition method, and then the MoS2/WS2 mixed layer is transferred to the surface of an h-BN substrate to form the heterojunction by the dry transfer technology. Or the MoS2 layer and the WS2 layer are respectively grown by adopting chemical vapor deposition, and then the MoS2 layer and the WS2 layer are transferred to the surface of the h-BN substrate in batches by utilizing a dry transfer technology to form the heterojunction, the obtained MoS2/WS2-h-BN heterojunction has excellent thermoelectric performance, the control requirement of the method on the chemical vapor deposition method is not very strict, the influence of the external environment is relatively small, and the method is suitable for industrial production. The method</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; ELECTRICITY ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; METALLURGY ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230307&amp;DB=EPODOC&amp;CC=CN&amp;NR=115768230A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20230307&amp;DB=EPODOC&amp;CC=CN&amp;NR=115768230A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WEI QIANGMIN</creatorcontrib><creatorcontrib>HUANG JUN</creatorcontrib><creatorcontrib>YANG BING</creatorcontrib><creatorcontrib>LIU YANGBOWEN</creatorcontrib><title>Heterojunction and preparation method and application thereof</title><description>The invention provides a heterojunction and a preparation method and application thereof, a route combining a chemical vapor deposition method and a dry transfer method is adopted, firstly, a MoS2/WS2 mixed layer is directly obtained through two-step growth by the chemical vapor deposition method, and then the MoS2/WS2 mixed layer is transferred to the surface of an h-BN substrate to form the heterojunction by the dry transfer technology. Or the MoS2 layer and the WS2 layer are respectively grown by adopting chemical vapor deposition, and then the MoS2 layer and the WS2 layer are transferred to the surface of the h-BN substrate in batches by utilizing a dry transfer technology to form the heterojunction, the obtained MoS2/WS2-h-BN heterojunction has excellent thermoelectric performance, the control requirement of the method on the chemical vapor deposition method is not very strict, the influence of the external environment is relatively small, and the method is suitable for industrial production. The method</description><subject>CHEMICAL SURFACE TREATMENT</subject><subject>CHEMISTRY</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</subject><subject>COATING MATERIAL WITH METALLIC MATERIAL</subject><subject>COATING METALLIC MATERIAL</subject><subject>DIFFUSION TREATMENT OF METALLIC MATERIAL</subject><subject>ELECTRICITY</subject><subject>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</subject><subject>METALLURGY</subject><subject>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLD1SC1JLcrPKs1LLsnMz1NIzEtRKChKLUgsSgTzc1NLMvJTwMKJBQU5mckQ4ZKM1KLU_DQeBta0xJziVF4ozc2g6OYa4uyhm1qQH59aXJCYnJqXWhLv7GdoaGpuZmFkbOBoTIwaAGprMMQ</recordid><startdate>20230307</startdate><enddate>20230307</enddate><creator>WEI QIANGMIN</creator><creator>HUANG JUN</creator><creator>YANG BING</creator><creator>LIU YANGBOWEN</creator><scope>EVB</scope></search><sort><creationdate>20230307</creationdate><title>Heterojunction and preparation method and application thereof</title><author>WEI QIANGMIN ; HUANG JUN ; YANG BING ; LIU YANGBOWEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN115768230A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2023</creationdate><topic>CHEMICAL SURFACE TREATMENT</topic><topic>CHEMISTRY</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL</topic><topic>COATING MATERIAL WITH METALLIC MATERIAL</topic><topic>COATING METALLIC MATERIAL</topic><topic>DIFFUSION TREATMENT OF METALLIC MATERIAL</topic><topic>ELECTRICITY</topic><topic>INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL</topic><topic>METALLURGY</topic><topic>SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION</topic><toplevel>online_resources</toplevel><creatorcontrib>WEI QIANGMIN</creatorcontrib><creatorcontrib>HUANG JUN</creatorcontrib><creatorcontrib>YANG BING</creatorcontrib><creatorcontrib>LIU YANGBOWEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WEI QIANGMIN</au><au>HUANG JUN</au><au>YANG BING</au><au>LIU YANGBOWEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Heterojunction and preparation method and application thereof</title><date>2023-03-07</date><risdate>2023</risdate><abstract>The invention provides a heterojunction and a preparation method and application thereof, a route combining a chemical vapor deposition method and a dry transfer method is adopted, firstly, a MoS2/WS2 mixed layer is directly obtained through two-step growth by the chemical vapor deposition method, and then the MoS2/WS2 mixed layer is transferred to the surface of an h-BN substrate to form the heterojunction by the dry transfer technology. Or the MoS2 layer and the WS2 layer are respectively grown by adopting chemical vapor deposition, and then the MoS2 layer and the WS2 layer are transferred to the surface of the h-BN substrate in batches by utilizing a dry transfer technology to form the heterojunction, the obtained MoS2/WS2-h-BN heterojunction has excellent thermoelectric performance, the control requirement of the method on the chemical vapor deposition method is not very strict, the influence of the external environment is relatively small, and the method is suitable for industrial production. The method</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language chi ; eng
recordid cdi_epo_espacenet_CN115768230A
source esp@cenet
subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title Heterojunction and preparation method and application thereof
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-10T13%3A23%3A04IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WEI%20QIANGMIN&rft.date=2023-03-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3ECN115768230A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true