Heat dissipation device, electronic equipment and electric equipment
The invention provides a heat dissipation device, electronic equipment and electric equipment. The heat dissipation device comprises a liquid cooling plate and heat exchange fins, the liquid cooling plate is provided with a first surface, a second surface and a first side face, the first surface and...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The invention provides a heat dissipation device, electronic equipment and electric equipment. The heat dissipation device comprises a liquid cooling plate and heat exchange fins, the liquid cooling plate is provided with a first surface, a second surface and a first side face, the first surface and the second surface are oppositely arranged, the first side face is connected with the first surface and the second surface, the first surface is used for installing an electronic device, and the heat exchange fins are arranged on the second surface; a cooling flow channel is arranged in the liquid cooling plate, a liquid inlet and a liquid outlet are further formed in the first side face of the liquid cooling plate, and the liquid inlet and the liquid outlet are communicated with the interior of the cooling flow channel. Therefore, according to the heat dissipation device, the mechanism strength can be improved, and the heat dissipation capacity of the heat dissipation device is further enhanced through the heat e |
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