Open type airborne electronic component mounting structure

The invention relates to an open type airborne electronic component mounting structure which comprises a module case, a switching case, a rib plate and a bottom plate. The adapter case is located on the rear side of the bottom plate, the rib plates are located on the two sides of the bottom plate an...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ZHANG SONGPENG, BU PENG, WEI SHOUPENG, ZHOU HAILIANG, LIU YINGUANG
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The invention relates to an open type airborne electronic component mounting structure which comprises a module case, a switching case, a rib plate and a bottom plate. The adapter case is located on the rear side of the bottom plate, the rib plates are located on the two sides of the bottom plate and the adapter case, and the rib plates are fixedly connected with the adapter case and the bottom plate. The front end of the module case is fixed on the bottom plate, and the switching case comprises a rectangular connector plug, a circular connector, a switching circuit module and a switching case shell. The module case is of a single-side uncovering structure and comprises a cover plate, a heat conduction rubber pad, a conductive rubber pad, a functional circuit module, a rectangular connector socket, a module case shell, cooling fins and a locking handle. The functional circuit module is independently packaged in the module case, a heating device is attached to the wall plate for heat dissipation, heat of the w