Sensing device and manufacturing method thereof

The present disclosure provides a sensing device including a substrate, a first electrode disposed on the substrate, a sensing element disposed on the first electrode and electrically connected to the first electrode, and a second electrode disposed on the sensing element and electrically connected...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LI DEYU, LIU YOUZONG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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