Sensing device and manufacturing method thereof

The present disclosure provides a sensing device including a substrate, a first electrode disposed on the substrate, a sensing element disposed on the first electrode and electrically connected to the first electrode, and a second electrode disposed on the sensing element and electrically connected to the sensing element, the second electrode including a first opening, and the first opening is overlapped with the sensing component. The invention further provides a manufacturing method of the sensing device. 本公开提供一种感测装置，包含基板、第一电极、感测组件以及第二电极，第一电极设置于基板上，感测组件设置于第一电极上且电性连接至第一电极，第二电极设置于感测组件上且电性连接至感测组件，再者，第二电极包含第一开口，且第一开口与感测组件重叠。本公开还提供一种感测装置的制作方法。