End sealing process of MLCC (multilayer ceramic capacitor)

The invention relates to an end capping process of an MLCC (multilayer ceramic capacitor). According to the end sealing process of the MLCC, after the CP board is used for loading the MLCC and the end sealing of one side is completed, the MLCC is directly and continuously glued on the end-sealed sid...

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Bibliographische Detailangaben
Hauptverfasser: CHEN SHAOGE, YANG WANJU, SU YEHUI, LIU CAIYAN, HUANG JIANYOU
Format: Patent
Sprache:chi ; eng
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Zusammenfassung:The invention relates to an end capping process of an MLCC (multilayer ceramic capacitor). According to the end sealing process of the MLCC, after the CP board is used for loading the MLCC and the end sealing of one side is completed, the MLCC is directly and continuously glued on the end-sealed side to fix the MLCC, and then the first gluing is removed, so that the other end face of the MLCC is exposed and the end sealing process is completed, a secondary CP board does not need to be used for butt joint and surface change, and the input cost of the secondary CP board is reduced. The end sealing process of the MLCC has the advantages of being stable in product production quality, low in loss and low in production cost. 本发明涉及一种MLCC的封端工艺。本发明所述的一种MLCC的封端工艺,使用CP板装载MLCC并完成的一侧封端后,直接在完成封端的一侧继续贴胶固定MLCC,然后去除第一次的贴胶,使MLCC的另一端面露出并完成封端工序,不需要再使用二次CP板来对接换面,减少了二次CP板的投入成本。本发明所述的一种MLCC的封端工艺具有产品生产质量稳定,损耗低,生产成本低的优点。