Potting product with low cost and high heat-conducting property and potting method thereof

The invention discloses a potting product with low cost and high heat-conducting property and a potting method thereof, and the potting product with low cost and high heat-conducting property comprises a housing, an electronic component and a packaging coating layer. The electronic component is arranged in the shell, and the packaging coating layer is coated on the peripheral surface of the electronic component; the encapsulation coating layer comprises at least one mixture layer and at least one potting adhesive layer along the height direction, the mixture layer is composed of a potting adhesive and a heat-conducting filler, the top layer of the potting product is the potting adhesive layer, and the mixture layer and the potting adhesive layer which are adjacent mutually permeate and are mixed. According to the potting product and the potting product obtained through the potting method, the heat conduction filler is filled to be matched with the potting adhesive to form the packaging coating layer, and the