Chip coating bubble prevention, control and elimination system based on visual positioning

The invention relates to the technical field of chip coating bubble elimination, and discloses a chip coating bubble prevention and control elimination system based on visual localization, after a to-be-coated silicon wafer is pushed to a proper position, a plurality of alignment cameras and the like are arranged, so that the situation that the cutting effect is influenced by the position deviation of the silicon wafer is avoided, and before a photoresist film is cut, the cutting effect is not influenced by the alignment cameras and the like. Through the arrangement of the pressing air cylinder and the like, the situation that a photoresist film on a silicon wafer is accidentally hooked up when the photoresist film is cut by a cutting knife is avoided, normal operation of the cutting process after film coating is completed is ensured, through the arrangement of the pressing sliding ball and the like, the situation that the redundant photoresist film around the silicon wafer is hooked up by the cutting knife d