Circuit board and copper deposition activation treatment method thereof

The invention provides a circuit board and a copper deposition activation treatment method thereof. The method comprises the following steps: carrying out preimpregnation treatment on a micro-etching washing substrate to obtain a to-be-activated plate; activating the to-be-activated plate to obtain a to-be-re-leached plate; carrying out re-immersion treatment on the to-be-re-immersed plate to obtain a to-be-immersed copper plate; and performing copper deposition treatment on the to-be-deposited copper plate to obtain the circuit board. After the to-be-activated plate is activated, the activating agent for attaching the copper foil is formed on the surface of the to-be-activated plate, and before copper deposition, the activated to-be-re-leached plate is re-leached, that is, the to-be-re-leached plate is re-leached again, so that the redundant activating agent on the to-be-re-leached plate does not enter the subsequent process any more; therefore, the redundant activating agent on the board to be re-immersed i