LED chip and manufacturing method thereof

The invention provides an LED chip and a manufacturing method thereof. The manufacturing method comprises the following steps: extending a dielectric layer to the side wall of a through hole of an epitaxial laminated layer; the metal reflecting layer is embedded into the dielectric hole to be in contact with the second type semiconductor layer in a mode of being stacked on the surface of the dielectric layer, and extends to the side wall of the through hole; the metal connecting layer is laminated on the surface of one side, deviating from the dielectric layer, of the metal reflecting layer, and the surface of one side, facing the epitaxial laminated layer, of the metal connecting layer is provided with an exposed surface; and the insulating layer extends to the side wall of the through hole in a mode of covering the metal connecting layer and the metal reflecting layer. Therefore, the metal reflecting layer extends into the through hole, the reflectivity in the through hole is improved, heat in the through h