Semiconductor device

The invention relates to a semiconductor device. And the performance of the semiconductor device is improved. The semiconductor device includes a semiconductor chip and a jig mounted on the semiconductor chip via a silver paste. Here, the semiconductor chip includes a passivation film having an opening, a source pad for the main transistor having a portion exposed from the passivation film at the opening, and a wall portion disposed on the passivation film to surround the source pad in a plan view. At this time, the entirety of the portion (exposed surface) of the source pad exposed from the passivation film is covered with a silver paste. Further, in plan view, a silver paste connecting the source pad and the jig is positioned inside a region surrounded by the wall portion without overflowing. 本公开涉及半导体器件。提高了半导体器件的性能。半导体器件包括半导体芯片和经由银膏安装在半导体芯片上的夹具。这里，半导体芯片包括具有开口的钝化膜、具有在开口处从钝化膜暴露的部分的用于主晶体管的源极焊盘、以及设置在钝化膜上以在平面图中包围源极焊盘的壁部。此时，从钝化膜暴露的源极焊盘的部分(暴露表面)的整体被银膏覆盖。此外，在平面图中，连接源极焊盘和夹具的银膏被定位在由壁部包围的区域的内部而没有溢出。