Packaging structure of support ring with inclined side wall

A package structure and a method of forming the same are provided. The package structure includes a package substrate, a first die, and a support ring. The first die is disposed on the package substrate and has a first sidewall and a second sidewall opposite to each other. The support ring is disposed on the package substrate to surround the first die. The support ring has an inner sidewall facing the first die, and the inner sidewall has at least an inclined sidewall facing the first sidewall of the first die. 提供一种封装结构及其形成方法。封装结构包括：封装衬底、第一管芯以及支撑环。第一管芯配置在封装衬底上且具有相对的第一侧壁与第二侧壁。支撑环配置在封装衬底上以环绕第一管芯。支撑环具有面向第一管芯的内侧壁，且该内侧壁至少具有面向第一管芯的第一侧壁的倾斜侧壁。